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3M Anisotropic Conductive Films
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3M Electrically Conductive Film
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High performance electrically conductive adhesive products that can be used to mechanically and electrically bond flexible circuits.
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3M™ Ultra Transparent Electrically Conductive Film 8880 S7 is a specialty coated polyester film with electrically conductive thin film.
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3M Form-In Place Gaskets
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3M High Transmission Mirror Film
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3M Form-in-Place Gasket FIPG is an epoxy-based resin system, ideal for sealing hard disk drive covers.
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High Transmission Mirror Film TF110 can be laminated to glass, polycarbonate, or other plastic lenses on handheld
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3M Light Cure Adhesive LC-1114
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3M Light Cure Adhesive LC-1214
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A one component, medium viscosity thixotropic adhesive that cures rapidly when exposed to UV light to form a flexible bond.
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One-component, medium-high viscosity adhesive that cures rapidly when exposed to visible or UV light to form a very flexible bond.
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3M Plastic Bonding Adhesive
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3M Scotch-Weld Bonding Film
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For reducing costs and streamlining assembly, 3M Plastic Bonding Adhesive 2665 is a product whose time has come. Based on
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Flexible, 100 percent solids, heat or solvent activated dry film adhesive composed of synthetic elastomer, thermoplastic, and thermosetting resins.
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3M Scotch-Weld Epoxy Adhesives for Electronics
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3M Scotch-Weld Structural Adhesive Film
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Superior structural adhesive performance where durability, environmental resistance and chemical resistance are necessary. Cures on demand when
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3M Scotch-Weld Structural Adhesive Films AF111 and AF142
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3M Thermally Conductive Adhesives
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3M Thermally Conductive Grease
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3M Thermally Conductive Adhesives are reworkable 2-part epoxies for high adhesion. Low CL ion content and outgassing. Minimal odor. Dispense manually or on automated line.
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Non curing, ultra-high performance thermal interface grease for transferring heat from a heat source (e.g. processor chip) to a heat sink. The
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3M Thermo-Bond Film
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3M Epoxy Encapsulant 1735
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Precise die cut shapes and sizes with uniform thickness for consistent bond lines. Range of bond strength to meet end use requirements
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Restricted to Hewlett Packard. 3M Epoxy Encapsulant 1735 10CC Syringe
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