Clear Electrical Grade, Two-Part, for Potting and Bonding Electronic Components. Electrolytically Non-Corrosive to Copper, Non-Exotherming and High Flow. It can be used for potting and bonding electronic components, and is electrolytically non-corrosive to copper. It has a 1:1 mix ratio and is a non-exotherming, high flow, clear product with a 70-minute.
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